EXPERIMENTAL INVESTIGATION AND NUMERICAL-SIMULATION OF SMC IN COMPRESSION MOLDING

被引:12
|
作者
KIM, DK [1 ]
CHOI, HY [1 ]
KIM, N [1 ]
机构
[1] HONGIK UNIV, DEPT MECH ENGN, SEOUL 121791, SOUTH KOREA
关键词
D O I
10.1016/0924-0136(94)01577-N
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Experimental investigation and numerical simulation were performed to study the compression molding of SMC. Laboratory-scaled molds were designed and built for experimental study of the SMC charges with different colored layers to enable visualization of the flow patterns. Temperature and flow patterns inside the SMC charge were measured for various process parameters such as mold temperature, mold geometry and closing speed. A thermo-viscoplastic finite-element program was developed to simulate compression molding. In the analytical study, the deformation of the material was modeled using a flow rule taking the fiber distribution into account. A kinetic model was adopted to describe the cure behaviour. The results of analysis and experiment were compared, showing good agreements with each other. The experimental findings combined with analytical results provided a sound understanding of SMC in compression molding.
引用
收藏
页码:333 / 344
页数:12
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