MICROCRACKING IN HARD CHROMIUM ELECTRODEPOSITS

被引：0

作者：

JONES, AR ^{[1
]}

机构：

[1] M&T CHEM INC,RAHWAY,NJ

来源：

PLATING AND SURFACE FINISHING | 1987年 / 74卷 / 05期

关键词：

D O I：

暂无

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

引用

页码：43 / 43

页数：1

共 50 条

[21] HARD CHROMIUM
HART, J
MACHINE DESIGN, 1969, 41 (11) : 144 - &
[22] THE ANALYSIS FOR LIGHT-ELEMENTS OF HARD GOLD ELECTRODEPOSITS
BENTLEY, AJ
EARWAKER, LG
FARR, JPG
POUNTNEY, J
SAREMI, M
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH, 1983, 218 (1-3): : 555 - 558
[23] RACK AND ANODE EFFECTS ON THE DISTRIBUTION OF FUNCTIONAL CHROMIUM ELECTRODEPOSITS
KNILL, EC
PLATING AND SURFACE FINISHING, 1989, 76 (01): : 62 - 69
[24] STRUCTURE AND PROPERTIES OF THIN CHEMICALLY TREATED CHROMIUM ELECTRODEPOSITS
SCHNEIDE.EJ
MARTIN, RL
KUPSIS, V
PURDY, SM
JOURNAL OF METALS, 1968, 20 (01): : A24 - &
[25] A SEMI-QUANTITATIVE METHOD FOR MEASURING THE DUCTILITY OF CHROMIUM ELECTRODEPOSITS
WYLLIE, MRJ
TRANSACTIONS OF THE ELECTROCHEMICAL SOCIETY, 1947, 92 : 519 - 536
[26] Relationship between deposition and recrystallization textures of copper and chromium electrodeposits
Joon Hwan Choi
Soo Young Kang
Dong Nyung Lee
Journal of Materials Science, 2000, 35 : 4055 - 4066
[27] Relationship between deposition and recrystallization textures of copper and chromium electrodeposits
Choi, JH
Kang, SY
Lee, DN
JOURNAL OF MATERIALS SCIENCE, 2000, 35 (16) : 4055 - 4066
[28] ELECTROCHEMICAL BEHAVIOR OF CARBONIZED CHROMIUM ELECTRODEPOSITS ON St3.
Ignatenko, P.I.
Kolomitsev, G.N.
Protection of Metals (English translation of Zaschita Metallov), 1980, 16 (04): : 385 - 386
[29] EFFECT OF SUBSTRATE MATERIAL ON INTERNAL-STRESS OF CHROMIUM ELECTRODEPOSITS
PUSHPAVANAM, M
MEENAL, VM
KRISHNAN, RM
NATARAJAN, SR
BULLETIN OF ELECTROCHEMISTRY, 1993, 9 (8-10): : 479 - 482
[30] THE EFFECTS OF PULSE PLATING ON LOW-CONTRACTION CHROMIUM ELECTRODEPOSITS
MILLER, M
PAN, SK
PLATING AND SURFACE FINISHING, 1992, 79 (07): : 49 - 56

← 1 2 3 4 5 →