JOINING SOLDERING, WELDING AND SURFACE MOUNTING - SOLDER INTERCONNECTS

被引:0
|
作者
OCLOCK, GD [1 ]
PETERS, MS [1 ]
PATER, JR [1 ]
KLEESE, GA [1 ]
MARTINI, RV [1 ]
机构
[1] MANKATO STATE UNIV,MANKATO,MN 56001
来源
MICROPROCESSING AND MICROPROGRAMMING | 1987年 / 19卷 / 05期
关键词
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
引用
收藏
页码:426 / 427
页数:2
相关论文
共 50 条
  • [21] VIAS IN SURFACE MOUNT COMPONENT MOUNTING LANDS - SOLDER DISTRIBUTION MODELING
    RUDY, DA
    PROCEEDINGS OF THE TECHNICAL CONFERENCE : EIGHTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, 1988, : 349 - 358
  • [22] HOW TO CHOOSE SOLDER PASTES FOR SURFACE MOUNTING - PART 2.
    Stein, Michael A.
    Electri-onics, 1985, 31 (08): : 28 - 32
  • [23] Soldering and solder paste prospects
    Hwang, Jennie S., 1600, (03):
  • [24] SOLDER JOINING TECHNOLOGY
    KOOPMAN, N
    ELECTRONIC PACKAGING MATERIALS SCIENCE IV, 1989, 154 : 431 - 440
  • [25] Solder joining in electronics
    Hwang, J.S.
    International Journal of Powder Metallurgy (Princeton, New Jersey), 2001, 37 (07): : 61 - 75
  • [26] Solder joining in electronics
    Hwang, JS
    INTERNATIONAL JOURNAL OF POWDER METALLURGY, 2001, 37 (07): : 61 - 75
  • [27] Investigations on Joining Surface Hardened Steels by Friction Welding
    Mitelea, Ion
    Craciunescu, Corneliu Marius
    MATERIALS TESTING, 2011, 53 (1-2) : 19 - 25
  • [28] MOUNTING AND SOLDERING WHEN ENTERING INTO SMD TECHNOLOGY
    BIANCHI, M
    F&M-FEINWERKTECHNIK & MESSTECHNIK, 1986, 94 (04): : 229 - 233
  • [29] Soldering technology adapts to dense mounting processes
    Nakajima, Masayuki
    JEE. Journal of electronic engineering, 1991, 28 (298): : 66 - 69
  • [30] WELDING AND JOINING
    不详
    METAL PROGRESS, 1973, 104 (01): : 205 - &