TAPE AUTOMATED BONDING FOR SENSORS

被引：0

作者：

EHRMANN, O

ENGELMANN, G

SIMON, J

REICHL, H

机构：

来源：

TECHNISCHES MESSEN | 1989年 / 56卷 / 11期

关键词：

D O I：

暂无

中图分类号：

TH7 [仪器、仪表];

学科分类号：

0804 ; 080401 ; 081102 ;

摘要：

引用

页码：415 / 417

页数：3

共 50 条

[1] TAPE AUTOMATED BONDING
HACKE, HJ
F&M-FEINWERKTECHNIK & MESSTECHNIK, 1990, 98 (12): : 553 - 556
[2] TAPE AUTOMATED BONDING DEVELOPMENT
WEILER, P
PROCEEDING OF THE TECHNICAL PROGRAM OF NEPCON WEST 89, VOLS 1 AND 2, 1989, : 473 - 484
[3] AN INSTALLED TAPE AUTOMATED BONDING UNIT
KURZWEIL, K
ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1980, 6 (3-4): : 159 - 163
[4] AUTOMATED TAPE CARRIER BONDING FOR HYBRIDS
OSWALD, RG
MONTANTE, JM
RODRIGUESDEMIRANDA, WR
SOLID STATE TECHNOLOGY, 1978, 21 (03) : 39 - 48
[5] DENSITY UPGRADING IN TAPE AUTOMATED BONDING
KURZWEIL, K
DEHAINE, G
ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1982, 10 (01): : 51 - 55
[6] INSPECTION OF TAPE AUTOMATED BONDING DEVICES
WU, FJ
PROCEEDING OF THE TECHNICAL PROGRAM OF NEPCON WEST 89, VOLS 1 AND 2, 1989, : 485 - 495
[7] STATUS OF TAPE AUTOMATED BONDING.
O'Neill, Timothy G.
Semiconductor International, 1981, 4 (02) : 33 - 51
[8] TAPE AUTOMATED BONDING SYSTEMS.
Keizer, Alan
Thompson, John
New Electronics, 1980, 13 (11):
[9] TAPE AUTOMATED BONDING MOVING INTO PRODUCTION
DEHAINE, G
KURZWEIL, K
SOLID STATE TECHNOLOGY, 1975, 18 (10) : 46 - 52
[10] REVIEW OF WATER BUMPING FOR TAPE AUTOMATED BONDING
LIU, TS
RODRIGUESDEMIRANDA, WR
ZIPPERLIN, PR
SOLID STATE TECHNOLOGY, 1980, 23 (03) : 71 - 76