TAPE AUTOMATED BONDING

被引：0
|
作者：
HACKE, HJ
机构：
来源：
F&M-FEINWERKTECHNIK & MESSTECHNIK | 1990年 / 98卷 / 12期
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Apart from wire contacting, the mounting of semi-conductors via prefabricated fine structures (figure 1) in the tape, the TAB technology, is becoming ever more important. This mounting technique is specifically suited for setting up small, flat and surface-mountable constructions for high-poled integrated circuits. Prerequisites and options for this technology are explained.
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页码：553 / 556
页数：4
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