BUBBLE-FREE SILICON-WAFER BONDING IN A NON-CLEANROOM ENVIRONMENT

被引：96
|
作者：
STENGL, R [1 ]
AHN, KY [1 ]
GOSELE, U [1 ]
机构：
[1] DUKE UNIV, SCH ENGN, DEPT MECH ENGN & MAT SCI, DURHAM, NC 27706 USA
来源：
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS | 1988年 / 27卷 / 12期
关键词：
D O I：
10.1143/JJAP.27.L2364
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
引用
收藏
页码：L2364 / L2366
页数：3
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