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- [48] Increasing the Lifetime of Electronic Packaging by Higher Temperatures: Solders vs. Silver Sintering 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 1700 - 1706
- [49] Influence of Mn on wettability and microstructure of low-silver lead-free solders China Welding (English Edition), 2015, 24 (03): : 11 - 17
- [50] Contact resistance changes of silver, silver alloys, and cold plated silver coupons exposed to ozone IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2000, 23 (02): : 317 - 322