MICROSTRUCTURE OF RAPIDLY SOLIDIFIED ALUMINUM-BASED IMMISCIBLE ALLOYS

被引:38
|
作者
KIM, WT
ZHANG, DL
CANTOR, B
机构
[1] Oxford Centre for Advanced Materials and Composites, Department of Materials, Oxford University, Oxford, OX1 3PH, Parks Road
关键词
D O I
10.1016/0921-5093(91)90940-O
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The microstructures of melt spun hypomonotectic Al-4.5wt.%Cd, Al-7wt.%In and hypoeutectic Al-5wt.%Sn and Al-10wt.%Sn have been studied by transmission electron microscopy. The alloy microstructures are formed by monotectic reaction with decreasing solidification rate through the melt spun ribbon thickness. Near the chilled ribbon surface, columnar aluminium grains contain a homogeneous distribution of fine scale cadmium, indium or tin particles; in the ribbon mid-section, cellular aluminium grains contain fine scale cadmium, indium or tin particles within the cells and coarse particles at the cell boundaries; and near the unchilled ribbon surface, cellular aluminium grains contain only coarse particles at the cell boundaries. The cadmium, indium and tin particles exhibit orientation relationships with the surrounding aluminium matrix, and faceted shapes bounded by {111}A1 and {100}A1. Particle-free zones of 0.2-0.5-mu-m thickness are often found adjacent to the aluminium grain boundaries, sometimes on one side and sometimes on both sides of the grain boundary.
引用
收藏
页码:1133 / 1138
页数:6
相关论文
共 50 条
  • [21] MICROSTRUCTURE AND STRENGTH OF RAPIDLY SOLIDIFIED MAGNESIUM ALLOYS
    IWASAKI, H
    MORI, T
    TAMURA, A
    HIGASHI, K
    TANIMURA, S
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1994, 179 : 712 - 716
  • [22] Microstructure formation and electrical resistivity behavior of rapidly solidified Cu-Fe-Zr immiscible alloys
    Xiaojun Sun
    Jie He
    Bin Chen
    Lili Zhang
    Hongxiang Jiang
    Jiuzhou Zhao
    Hongri Hao
    [J]. Journal of Materials Science & Technology, 2020, 44 (09) : 201 - 208
  • [23] Microstructure formation and electrical resistivity behavior of rapidly solidified Cu-Fe-Zr immiscible alloys
    Sun, Xiaojun
    He, Jie
    Chen, Bin
    Zhang, Lili
    Jiang, Hongxiang
    Zhao, Jiuzhou
    Hao, Hongri
    [J]. He, Jie (jiehe@imr.ac.cn), 1600, Chinese Society of Metals (44): : 201 - 208
  • [24] Microstructure formation and electrical resistivity behavior of rapidly solidified Cu-Fe-Zr immiscible alloys
    Sun, Xiaojun
    He, Jie
    Chen, Bin
    Zhang, Lili
    Jiang, Hongxiang
    Zhao, Jiuzhou
    Hao, Hongri
    [J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 44 : 201 - 208
  • [25] Model for calculation of microstructural development in rapidly directionally solidified immiscible alloys
    Zhao, JZ
    [J]. TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2002, 12 (03) : 366 - 369
  • [27] LASERGLAZING OF ALUMINUM-BASED ALLOYS
    JOST, N
    HADDENHORST, H
    [J]. JOURNAL OF MATERIALS SCIENCE LETTERS, 1991, 10 (15) : 913 - 916
  • [28] PREPARATION AND MICROSTRUCTURE OF A RAPIDLY SOLIDIFIED ALUMINUM-ALLOY
    GILMORE, CJ
    BOWEN, AW
    [J]. EUREM 88, VOLS 1-3: TUTORIALS, INSTRUMENTATION AND TECHNIQUES / PHYSICS AND MATERIALS / BIOLOGY, 1988, 93 : 199 - 200
  • [29] PREPARATION AND MICROSTRUCTURE OF A RAPIDLY SOLIDIFIED ALUMINUM-ALLOY
    GILMORE, CJ
    BOWEN, AW
    [J]. INSTITUTE OF PHYSICS CONFERENCE SERIES, 1988, (93): : 199 - 200
  • [30] MICROSTRUCTURE AND GRAIN-GROWTH IN RAPIDLY SOLIDIFIED ALUMINUM
    BARLOW, CY
    RALPH, B
    [J]. METALLOGRAPHY, 1985, 18 (02): : 171 - 181