A HIGH ASPECT RATIO VIA HOLE DRY ETCHING TECHNOLOGY FOR HIGH-POWER GAAS-MESFET

被引:0
|
作者
SUMITANI, K
KOMARU, M
KOBIKI, M
HIGAKI, Y
MITSUI, Y
TAKANO, H
NISHITANI, K
机构
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:207 / 210
页数:4
相关论文
共 50 条
  • [31] The Study of Latex Sphere Lithography for High Aspect Ratio Dry Silicon Etching
    Morozov, Ivan
    Gudovskikh, Alexander
    Uvarov, Alexander
    Baranov, Artem
    Sivakov, Vladimir
    Kudryashov, Dmitri
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2019, 217 (04):
  • [32] Dry Etching of High Aspect Ratio 4H-SiC Microstructures
    Luna, Lunet E.
    Tadjer, Marko J.
    Anderson, Travis J.
    Imhoff, Eugene A.
    Hobart, Karl D.
    Kub, Fritz J.
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2017, 6 (04) : P207 - P210
  • [33] Kinetics and crystal orientation dependence in high aspect ratio silicon dry etching
    Blauw, MA
    Zijlstra, T
    Bakker, RA
    van der Drift, E
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2000, 18 (06): : 3453 - 3461
  • [34] Critical tasks in high aspect ratio silicon dry etching for microelectromechanical systems
    Rangelow, IW
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2003, 21 (04): : 1550 - 1562
  • [35] The application of secondary effects in high aspect ratio dry etching for the fabrication of MEMS
    Volland, BE
    Heerlein, H
    Kostic, I
    Rangelow, IW
    MICROELECTRONIC ENGINEERING, 2001, 57-8 : 641 - 650
  • [36] High aspect ratio via etching conditions for deep trench of silicon
    Park, WJ
    Kim, JH
    Cho, SM
    Yoon, SG
    Suh, SJ
    Yoon, DH
    SURFACE & COATINGS TECHNOLOGY, 2003, 171 (1-3): : 290 - 295
  • [37] Dry via hole etching of GaAs using high-density Cl2/Ar plasma
    Chen, YW
    Ooi, BS
    Ng, GI
    Radhakrishnan, K
    Tan, CL
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2000, 18 (05): : 2509 - 2512
  • [38] HIGH-GAIN WIDEBAND AMPLIFIER IC USING 0.7-MU-M GAAS-MESFET TECHNOLOGY
    KINOSHITA, T
    YAMASHITA, K
    KOTERA, N
    MAEDA, M
    ELECTRONICS LETTERS, 1988, 24 (02) : 89 - 90
  • [39] High-power GaN MESFET on sapphire substrate
    Gaquiere, C
    Trassaert, S
    Boudart, B
    Crosnier, Y
    IEEE MICROWAVE AND GUIDED WAVE LETTERS, 2000, 10 (01): : 19 - 20
  • [40] Flow rate rule for high aspect ratio SiO2 hole etching
    Chinzei, Yasuhiko
    Ogata, Makoto
    Shindo, Haruo
    Ichiki, Takanori
    Horiike, Yasuhiro
    Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, 1998, 16 (03): : 1519 - 1524