METALLIZATION FOR INTEGRATED-CIRCUITS USING A LIFT-OFF TECHNIQUE

被引：27
|
作者：
WIDMANN, DW [1 ]
机构：
[1] SIEMENS AG,RES LABS,MUNICH,FED REP GER
来源：
IEEE JOURNAL OF SOLID-STATE CIRCUITS | 1976年 / 11卷 / 04期
关键词：
D O I：
10.1109/JSSC.1976.1050760
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：466 / 471
页数：6
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