共 50 条
- [23] An empirical study of fan-in and fan-out in Java OSS 8th ACIS International Conference on Software Engineering Research, Management and Applications, SERA 2010, 2010, : 36 - 41
- [24] Electrical, Thermal, and Mechanical Characterization of eWLB, Fully Molded Fan-Out Package, and Fan-Out Chip Last Package IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 9 (09): : 1765 - 1775
- [25] FAN-OUT CONSIDERATIONS OF DIGITAL OPTICAL CIRCUITS APPLIED OPTICS, 1987, 26 (09): : 1741 - 1744
- [27] Approach with Large Panel Fan-Out Technology 2024 International Conference on Electronics Packaging, ICEP 2024, 2024, : 175 - 176
- [28] Electrical Performances of Fan-Out Embedded Bridge IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 2030 - 2034
- [30] Simulation Improved Testing of Fan-out Packaging PROCEEDINGS OF THE 17TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2018), 2018, : 1142 - 1145