LASER DIRECT WRITING OF COPPER ON VARIOUS THIN-FILM SUBSTRATE MATERIALS

被引：18
|
作者：
MULLER, HG
BUSCHICK, K
SCHULER, S
PAREDES, A
机构：
来源：
APPLIED SURFACE SCIENCE | 1990年 / 46卷 / 1-4期
关键词：
D O I：
10.1016/0169-4332(90)90133-K
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
Laser direct writing of copper from dried-on copper formate films on Al2O3, AlN, polyimide and aluminum is described. Writing speeds of 1 to 50 mm/s, and a laser power of up to 2 W have been used. On polyimide, argon laser writing is the preferred method. It is shown that multichip module interconnections may be written successfully with this method. © 1990.
引用
收藏
页码：143 / 147
页数：5
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