LASER DIRECT WRITING OF COPPER ON VARIOUS THIN-FILM SUBSTRATE MATERIALS

被引：18

作者：

MULLER, HG

BUSCHICK, K

SCHULER, S

PAREDES, A

机构：

来源：

APPLIED SURFACE SCIENCE | 1990年 / 46卷 / 1-4期

关键词：

D O I：

10.1016/0169-4332(90)90133-K

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Laser direct writing of copper from dried-on copper formate films on Al2O3, AlN, polyimide and aluminum is described. Writing speeds of 1 to 50 mm/s, and a laser power of up to 2 W have been used. On polyimide, argon laser writing is the preferred method. It is shown that multichip module interconnections may be written successfully with this method. © 1990.

引用

页码：143 / 147

页数：5

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