THERMAL-STRESSES DEVELOPED IN THIN-FILMS OF GERMANIUM

被引：1

作者：

ARORA, RK

机构：

来源：

MICROELECTRONICS AND RELIABILITY | 1985年 / 25卷 / 05期

关键词：

D O I：

10.1016/S0026-2714(85)80016-0

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：895 / 898

页数：4

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