THERMOSONIC GOLD WIRE BONDING TO COPPER CONDUCTORS

被引：0
|
作者：
PITT, VA
NEEDES, CRS
机构：
来源：
SOLID STATE TECHNOLOGY | 1983年 / 26卷 / 03期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
8
引用
收藏
页码：81 / 86
页数：6
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