共 50 条
- [31] CONTROLLED QUALITY TESTING OF MATERIALS USED IN THICK-FILM MATERIALS [J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1982, 61 (09): : 944 - 944
- [32] DEVELOPMENT OF THE THICK-FILM CAPACITOR AND ITS APPLICATION FOR HYBRID CIRCUIT MODULES [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1979, 2 (04): : 434 - 441
- [33] LOW-FIRING DOUBLE-LAYERED THICK-FILM CAPACITOR [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (04): : 672 - 675
- [35] THE INFLUENCE OF FAST INFRARED FIRING ON THICK-FILM MATERIALS [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1983, 6 (04): : 436 - 442
- [37] Thick-film Hybrid Microcircuit Materials and Technologies. [J]. Elektronika Warszawa, 1981, 22 (02): : 21 - 25
- [39] INTERFACING OF CONDUCTORS WITH THICK-FILM MATERIALS FOR HYBRID MICROELECTRONICS [J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1974, 53 (08): : 606 - 606
- [40] DEVELOPMENT OF TEMPERATURE-STABLE THICK-FILM DIELECTRICS .3. ROLE OF GLASS ON THE MICROSTRUCTURE EVOLUTION OF A THICK-FILM DIELECTRIC [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1991, 14 (03): : 645 - 649