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- [9] Flux Challenges in Flip-Chip Die-Attach 2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,
- [10] Impact of die-attach materials on MEMS Gyro performance 2014 1ST IEEE INTERNATIONAL SYMPOSIUM ON INERTIAL SENSORS AND SYSTEMS (ISISS 2014), 2014, : 125 - 126