BICMOS SMART POWER CHIP FOR DISK DRIVES OPERATES ON 3V SUPPLIES

被引:0
|
作者
NESSI, M
FUCILLI, G
机构
来源
ELECTRONIC ENGINEERING | 1993年 / 65卷 / 804期
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:43 / 44
页数:2
相关论文
共 47 条
  • [31] A detailed study of Qdc of 3D micro air-core inductors for integrated power supplies: Power supply in package (PSiP) and power supply on chip (PSoC)
    Shetty C.
    Power Electronic Devices and Components, 2022, 2
  • [32] A 3V to 6V in, 6A out synchronous buck PWM integrated FET switcher design uses state-of-art power IC technology
    Grant, D
    Briggs, D
    Daniels, D
    Efland, T
    King, B
    Ramani, R
    Skelton, D
    Tsai, CY
    Tucker, J
    Miftakhutdinov, R
    Martinez, R
    PROCEEDINGS OF THE 14TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & ICS, 2002, : 213 - 216
  • [33] A Low-Noise, Low-Power Neural Signal Amplifier for Deep Brain Stimulation System Chips Tolerating 3V Stimulation
    Hsu, Chia-Hua
    Lin, Yu -Wei
    Tang, Kea-Tiong
    2024 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, ISCAS 2024, 2024,
  • [34] Power and Area Optimization of 3D Networks-on-Chip Using Smart and Efficient Vertical Channels
    Rahmani, Amir-Mohammad
    Vaddina, Kameswar Rao
    Liljeberg, Pasi
    Plosila, Juha
    Tenhunen, Hannu
    INTEGRATED CIRCUIT AND SYSTEM DESIGN: POWER AND TIMING MODELING, OPTIMIZATION, AND SIMULATION, 2011, 6951 : 278 - 287
  • [35] Single-chip smart power camera controller with photodiode current measurement down to 3nA
    Rossi, D
    Pedrazzini, G
    Pozzoni, M
    Ricotti, G
    Ravanelli, E
    Strizhak, E
    Kackprowicz, M
    1996 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE, DIGEST OF TECHNICAL PAPERS, 1996, 39 : 336 - 337
  • [36] 0.4um High Voltage CMOS Smart Power Technology: 120V LD NMOS for integrated System on Chip applications
    Patel, Nayan
    16TH INTERNATIONAL WORKSHOP ON PHYSICS OF SEMICONDUCTOR DEVICES, 2012, 8549
  • [37] High performance super self-aligned 3 V/5 V BiCMOS technology with extremely low parasitics for low-power mixed-signal applications
    AT&T Bell Lab, Holmdel, United States
    IEEE Trans Electron Devices, 3 (513-522):
  • [38] GaN HEMTs Enabling Ultra-Compact and Highly Efficient 3kW 12V Server Power Supplies
    Kasper, Matthias
    Deboy, Gerald
    2018 IEEE INTERNATIONAL POWER ELECTRONICS AND APPLICATION CONFERENCE AND EXPOSITION (PEAC), 2018, : 1059 - 1064
  • [39] A Ka-Band VCO Chip with Integrated Dividers Using 1.5V Supply in 130-nm SiGe BiCMOS Technology for Low-Power Radar Sensors
    Sutbas, Batuhan
    Eissa, Mohamed Hussein
    Kahmen, Gerhard
    2023 IEEE BICMOS AND COMPOUND SEMICONDUCTOR INTEGRATED CIRCUITS AND TECHNOLOGY SYMPOSIUM, BCICTS, 2023, : 102 - 105
  • [40] Improved HV-H3TRB robustness of a 1700 V IGBT chip set in standard power modules
    Peters, J.-H.
    Hanf, M.
    Clausner, S.
    Zorn, C.
    Kaminski, N.
    Microelectronics Reliability, 2021, 126