PRINTED-CIRCUIT-BOARD DESIGN SERVICE BUREAUS

被引：0
|
作者：
FREEMAN, E
机构：
来源：
EDN | 1985年 / 30卷 / 18期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：126 / 138
页数：13
相关论文
共 50 条
  • [41] An Embedded Wi-Fi Front-End-Module in Printed-Circuit-Board by Employing Printed lines
    Ryu, Jong-In
    Park, Se-Hoon
    Kim, Dongsu
    Kim, Jun-Chul
    2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 1822 - 1827
  • [42] Study on Series Printed-Circuit-Board Coil Matrix for Misalignment-Insensitive Wireless Charging
    Li, Jianchao
    Wang, Liming
    Yin, Fanghui
    2019 IEEE MTT-S WIRELESS POWER TRANSFER CONFERENCE (WPTC) / IEEE PELS WORKSHOP ON EMERGING TECHNOLOGIES: WIRELESS POWER (WOW) / WIRELESS POWER WEEK (WPW 2019), 2019, : 98 - 101
  • [43] Coreless planar printed-circuit-board (PCB) transformers - A fundamental concept for signal and energy transfer
    Tang, SC
    Hui, SY
    Chung, HSH
    IEEE TRANSACTIONS ON POWER ELECTRONICS, 2000, 15 (05) : 931 - 941
  • [44] Conveyor-belt speed measuring method used in printed-circuit-board processing lines
    Krylov, A.I.
    Pribory i Sistemy Upravleniya, 1992, (08):
  • [45] Modeling the Effects of Printed-Circuit-Board Parasitics on the Switching Performance of Wide-Bandgap Applications
    Hammer, Jan
    Ordonez, Martin
    Ksiazek, Peter
    THIRTY-FOURTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2019), 2019, : 1231 - 1236
  • [46] Effects of printed-circuit-board layout on power switch case-to-ambient thermal resistance
    Chen, Y
    Chen, GZ
    Smedley, K
    IECON'03: THE 29TH ANNUAL CONFERENCE OF THE IEEE INDUSTRIAL ELECTRONICS SOCIETY, VOLS 1 - 3, PROCEEDINGS, 2003, : 694 - 698
  • [47] PRINTED-CIRCUIT BOARD DESIGN - SOFTWARE TOOLS SPEED CIRCUIT-BOARD DESIGN
    PARDEE, S
    PENNINO, TP
    IEEE SPECTRUM, 1988, 25 (09) : 40 - 44
  • [48] Broadband Printed-Circuit-Board Characterization Using Multimode Substrate-Integrated-Waveguide Resonator
    Wang, Hong Bin
    Cheng, Yu Jian
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2017, 65 (06) : 2145 - 2152
  • [49] Effect of Moisture on Thermal Properties of Halogen-Free and Halogenated Printed-Circuit-Board Laminates
    Ma, Lili
    Sood, Bhanu
    Pecht, Michael
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2011, 11 (01) : 66 - 75
  • [50] CAD IN PRINTED CIRCUIT-BOARD DESIGN
    FISCHER, P
    SCHMITT, B
    F&M-FEINWERKTECHNIK & MESSTECHNIK, 1990, 98 (03): : 79 - 80
12345