共 50 条
- [42] Low-temperature bonding of thick-film polysilicon for microelectromechanical system (MEMS) [J]. MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2006, 12 (05): : 401 - 405
- [43] Low-temperature bonding of thick-film polysilicon for microelectromechanical system (MEMS) [J]. Microsystem Technologies, 2006, 12 : 401 - 405
- [44] MODIFIED SPEER RESISTORS FOR USE AS LOW TEMPERATURE THERMOMETERS [J]. REVIEW OF SCIENTIFIC INSTRUMENTS, 1969, 40 (11): : 1512 - +
- [45] CERAMIC CHIP CAPACITORS AS LOW-TEMPERATURE THERMOMETERS [J]. CRYOGENICS, 1992, 32 (01) : 44 - 46
- [46] The Effect of Firing Conditions on the Characteristics of Thick-film Resistors for Temperature Sensors [J]. INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS, 2024, 54 (01): : 17 - 24
- [47] TEMPERATURE-COEFFICIENT OF RESISTIVITY IN THICK-FILM RESISTORS AND PERCOLATION MODEL [J]. ALTA FREQUENZA, 1977, 46 (06): : 287 - 288
- [48] THICK-FILM FAIL-SAFE RESISTORS [J]. ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1983, 10 (04): : 255 - 260
- [49] THERMAL-DEGRADATION OF THICK-FILM RESISTORS [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1977, 124 (03) : C95 - C95
- [50] STABILITY AND DETERIORATION MECHANISM OF THICK-FILM RESISTORS [J]. MICROELECTRONICS AND RELIABILITY, 1974, 13 (04): : 281 - 289