Characteristics of Ti Platinization for Fabrication Sn-modified Platinized Ti Electrode

This work investigated a fabrication way of stable platinized Ti electrode and evaluated the electrochemical characteristics of the Sn-modified platinized Ti electrode in nitrate solution. A Pt electro-plating way to form some open special clearances within the Pt coating layer on etched Ti substrate was very important to remove effectively the residual contaminate due to plating solution out of the fabricated electrode surface and to maximize the actual electrode surface area contacting solution. Both boiling and electro-cleaning processes of the fabricated electrode was essential to obtain a stable platinized-Pt electrode with reproducible and stable surface property which was necessary for the correct evaluation of Sn coverage on the electrode. The electro-cleaning caused a morphology change of the platinized Ti electrode surface with some downy hair-like polyps formed during the deposition disappearing, which made the electrode stable. The Sn-modified platinized Ti electrode in this work showed the best electro-activity for nitrate reduction, when it was fabricated through the Pt electro-plating of about 30 minutes.