CAPACITANCE MODELS FOR INTEGRATED-CIRCUIT METALLIZATION WIRES

被引：62

作者：

RUEHLI, AE ^{[1
]}

BRENNAN, PA ^{[1
]}

机构：

[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598

来源：

IEEE JOURNAL OF SOLID-STATE CIRCUITS | 1975年 / 10卷 / 06期

关键词：

D O I：

10.1109/JSSC.1975.1050654

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：530 / 536

页数：7

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