ANISOTROPIC-PLASMA ETCHING OF POLYSILICON USING SF6 AND CFCL3

被引：12
|
作者：
MIETH, M
BARKER, A
机构：
来源：
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1983年 / 1卷 / 02期
关键词：
D O I：
10.1116/1.572195
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
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页码：629 / 635
页数：7
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