共 50 条
- [21] A study on the thermal deformation of ACF assemblies using moire interferometry and FEM PROCEEDINGS OF INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2000, : 358 - 363
- [23] Macro and micro process modeling of the cutting of carbon fiber reinforced plastics using FEM 11TH INTERNATIONAL CONFERENCE ON THE MECHANICAL BEHAVIOR OF MATERIALS (ICM11), 2011, 10 : 1823 - 1828
- [24] Study on fatigue damage accumulation process by using crystalline FEM analysis PRACTICAL DESIGN OF SHIPS AND MOBILE UNITS, 1998, 11 : 897 - 903
- [25] Modeling the Cracking Process of the YSZ Thermal Barrier Coating under the Thermal Shocking Loads HIGH-PERFORMANCE CERAMICS VII, PTS 1 AND 2, 2012, 512-515 : 463 - +
- [27] Study on Failure Mode and Mechanism of Bond Pad under Cu Ball Bonding Process using Wire Pull Test and Finite Element Modeling 2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,
- [28] Comparative study of FVM and FEM using rectangular element in heat conduction problems for conductive materials ADVANCED RESEARCH ON INTELLIGENT MATERIALS AND MECHANICAL ENGINEERING, 2011, 321 : 131 - 135
- [29] Electrical modeling of wirebonds in stacked ICs using cylindrical conduction mode basis functions 58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, : 1225 - 1230
- [30] Evaluation of DEM and FEM/DEM in Modeling the Fracture Process of Glass Under Hard-Body Impact PROCEEDINGS OF THE 7TH INTERNATIONAL CONFERENCE ON DISCRETE ELEMENT METHODS, 2017, 188 : 377 - 388