Electrochemical Properties of Nitride Phases in the Si3N4–Ca3N2and Si3N4–AlN–Ca3N2Systems

被引：0
|
作者：
S. F. Pal'guev
R. P. Lesunova
E. I. Burmakin
E. S. Korovenkova
机构：
[1] Russian Academy of Sciences,Institute of High
来源：
Inorganic Materials | 2001年 / 37卷
关键词：
Calcium; Aluminum; Silicon; Electrical Conductivity; Inorganic Chemistry;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The electrical conductivity of silicon nitride and its solid solutions with calcium nitride and aluminum nitride was measured in the ranges 400–900 and 1000–1300°C. The conduction mechanisms were found to be substantially different in these temperature ranges. The Si3N4–Ca3N2solid solutions exhibited high ionic conductivity between 400 and 900°C. The densest and most oxidation-resistant materials were obtained in the Si3N4–AlN–Ca3N2system (Al introduced as fine powder and then nitrided).
引用
收藏
页码：684 / 687
页数：3
相关论文
共 50 条
  • [41] Nanofilaments of Si3N4
    Yu. F. Kargin
    S. N. Ivicheva
    N. A. Ovsyannikov
    A. S. Lysenkov
    A. S. Chernyavsky
    N. A. Alad’ev
    S. V. Kutsev
    Inorganic Materials, 2009, 45
  • [42] BRAZING OF SI3N4
    BECHER, PF
    HALEN, SA
    AMERICAN CERAMIC SOCIETY BULLETIN, 1977, 56 (03): : 302 - 302
  • [43] Synthesis of Si3N4
    Cano, IG
    Rodríguez, MA
    BOLETIN DE LA SOCIEDAD ESPANOLA DE CERAMICA Y VIDRIO, 2003, 42 (02): : 89 - 92
  • [44] Nanofilaments of Si3N4
    Kargin, Yu. F.
    Ivicheva, S. N.
    Ovsyannikov, N. A.
    Lysenkov, A. S.
    Chernyavsky, A. S.
    Alad'ev, N. A.
    Kutsev, S. V.
    INORGANIC MATERIALS, 2009, 45 (05) : 511 - 516
  • [45] Si3N4-ZrO2 composite with precipitated α-Si3N4 whisker
    Mori, Toshiyuki
    Arakawa, Toshihiko
    Higuchi, Shinji
    Nippon Seramikkusu Kyokai Gakujutsu Ronbunshi/Journal of the Ceramic Society of Japan, 1988, 96 (07): : 744 - 748
  • [46] The Research on High Pressure Sintering of Mixed Powder γ-Si3N4 and α-Si3N4
    Yao, Huai
    Wang, Yongzhi
    Xu, Bo
    MATERIALS AND DESIGN, PTS 1-3, 2011, 284-286 : 1397 - 1400
  • [47] Effect of the microstructureOf Si3N4 on the adhesion strength of TiN film on Si3N4
    Kim, Young-Gu
    Tatami, Junichi
    Komeya, Katsutoshi
    Kim, Do Kyung
    THIN SOLID FILMS, 2006, 510 (1-2) : 222 - 228
  • [48] Processing and mechanical properties of Si3N4/SiC nanocomposites using Si nitrided Si3N4 powder
    Yang, JF
    Sekino, T
    Choa, YH
    Niihara, K
    MATERIALS SCIENCE RESEARCH INTERNATIONAL, 1999, 5 (02): : 84 - 89
  • [49] Development of a new CuNiTiB brazing alloy for joining Si3N4 to Si3N4
    Huaping Xiong
    Chuangeng Wan
    Zhenfeng Zhou
    Metallurgical and Materials Transactions A, 1998, 29 : 2591 - 2596
  • [50] Si3N4/Si3N4陶瓷连接的研究进展
    周飞
    陈静
    罗启富
    李志章
    硅酸盐通报, 1997, (02) : 41 - 46
12345