A closed-form solution for thermal buckling of piezoelectric FGM rectangular plates with temperature-dependent properties

被引：0
|
作者：
B. Mirzavand
M. R. Eslami
机构：
[1] Shahrekord University,Mechanical Engineering Department, Faculty of Engineering
[2] Amirkabir University of Technology,Academy of Sciences, Mechanical Engineering Department
来源：
Acta Mechanica | 2011年 / 218卷
关键词：
Piezoelectric Actuator; Thermal Buckling; Plate Aspect Ratio; Actuator Layer; Uniform Temperature Rise;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
A thermal buckling analysis is presented for functionally graded rectangular plates that are integrated with surface-bonded piezoelectric actuators and are subjected to the combined action of thermal load and constant applied actuator voltage. The temperature-dependent material properties of the functionally graded plate are assumed to vary as a power form of the thickness coordinate. Derivation of the equations is based on the third-order shear deformation plate theory. Results for the critical buckling temperatures are obtained in closed-form solution, which are convenient to be used in engineering design applications. The effects of the applied actuator voltage, plate geometry, and volume fraction exponent of the functionally graded material on the buckling temperature are investigated.
引用
收藏
页码：87 / 101
页数：14
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