Modular parametric finite element modelling for reliability-studies in electronic and mems packaging

被引：1
|
作者：
B. Wunderle
J. Auersperg
V. Großer
E. Kaulfersch
O. Wittler
B. Michel
机构：
[1] Fraunhofer Institut Zuverlässigkeit und Mikrointegration,Technologien der Mikroperipherik
[2] AMIC-Angewandte Mikromeßtechnik GmbH,undefined
[3] Technische Universität Berlin,undefined
来源：
Microsystem Technologies | 2004年 / 10卷 / 5期
关键词：
Solder Joint; Energy Release Rate; Solder Bump; Microelectronic Packaging; Solder Joint Reliability;
D O I：
10.1007/BF02637107
中图分类号：
学科分类号：
摘要：
A modular and parametric approach to FE-modelling is presented which allows rapid virtual prototyping for MEMS and other microelectronics packages with respect to some topical reliability issues: Thermal management and thermo-mechanical fatigue. Thereby the method of automatic model generation by modular parametric modelling is outlined and some examples featuring the required solution techniques are given. This simulation procedure forms part of a comprehensive design optimisation process in the field of predictive engineering.
引用
收藏
页码：375 / 381
页数：6
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