Responsive materials and mechanisms as thermal safety systems for skin-interfaced electronic devices

被引:0
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作者
Seonggwang Yoo
Tianyu Yang
Minsu Park
Hyoyoung Jeong
Young Joong Lee
Donghwi Cho
Joohee Kim
Sung Soo Kwak
Jaeho Shin
Yoonseok Park
Yue Wang
Nenad Miljkovic
William P. King
John A. Rogers
机构
[1] Northwestern University,Querrey Simpson Institute for Bioelectronics
[2] University of Illinois at Urbana-Champaign,Department of Mechanical Science and Engineering
[3] University of California,Department of Electrical and Computer Engineering
[4] Korea Research Institute of Chemical Technology,Thin Film Materials Research Center
[5] Korea Institute of Science and Technology,Bionics Research Center of Biomedical Research Division
[6] Kyung Hee University,Department of Advanced Materials Engineering for Information and Electronics
[7] Northwestern University,Department of Biomedical Engineering
[8] Northwestern University,Department of Materials Science and Engineering
[9] Northwestern University,Department of Chemistry
[10] Northwestern University,Department of Neurological Surgery, Feinberg School of Medicine
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摘要
Soft, wireless physiological sensors that gently adhere to the skin are capable of continuous clinical-grade health monitoring in hospital and/or home settings, of particular value to critically ill infants and other vulnerable patients, but they present risks for injury upon thermal failure. This paper introduces an active materials approach that automatically minimizes such risks, to complement traditional schemes that rely on integrated sensors and electronic control circuits. The strategy exploits thin, flexible bladders that contain small volumes of liquid with boiling points a few degrees above body temperature. When the heat exceeds the safe range, vaporization rapidly forms highly effective, thermally insulating structures and delaminates the device from the skin, thereby eliminating any danger to the skin. Experimental and computational thermomechanical studies and demonstrations in a skin-interfaced mechano-acoustic sensor illustrate the effectiveness of this simple thermal safety system and suggest its applicability to nearly any class of skin-integrated device technology.
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