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- [33] High Reliability Lead-free Alloys for Performance-Critical Applications 2018 7TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2018,
- [34] Preparation of high grade monosized particles of lead-free solder alloys PRICM 4: FORTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, VOLS I AND II, 2001, : 1131 - 1134
- [35] Underfill selection strategy for low k, high lead/lead-free flip chip application 2007 INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE, PROCEEDINGS OF TECHNICAL PAPERS, 2007, : 338 - 341
- [39] Effect of Deformation by High-Pressure Torsion in a Combined Matrix on the Properties of Brass Metallurgist, 2023, 66 : 1601 - 1606
- [40] The effect of current crowding on electromigration in lead-free flip chip bump interconnect PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04), 2004, : 224 - 226