Interlayer Material Design Reducing Transient Liquid Phase Bonding Time

被引：0
|
作者：
Sunghyun Sohn
Byungrok Moon
Junghoon Lee
Namhyun Kang
Younghoon Moon
机构：
[1] Pusan National University,Department of Materials Science and Engineering
[2] Pusan National University,School of Mechanical Engineering
来源：
Electronic Materials Letters | 2020年 / 16卷
关键词：
Transient liquid phase bonding; Die attach; Power semiconductors; Intermetallic compounds; Interlayer materials;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：106 / 114
页数：8
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