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- [21] Fully integrated AC coupled interconnect using buried bumps IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2007, 30 (02): : 191 - 199
- [22] Numerical modelling and experimental study of an AC magnetohydrodynamic (MHD) micropump 2006 IEEE INSTRUMENTATION AND MEASUREMENT TECHNOLOGY CONFERENCE PROCEEDINGS, VOLS 1-5, 2006, : 2249 - +
- [25] FLUID FLOW STUDY OF AN AC ELECTROTHERMAL MICROPUMP CONSISTING OF MULTIPLE ARRAYS OF MICROELECTRODES FOR BIOFLUID APPLICATIONS MICROFLUIDICS, BIOMEMS, AND MEDICAL MICROSYSTEMS XIII, 2015, 9320
- [29] A Comparative Analysis of Lithium-Ion Batteries Using a Proposed Electrothermal Model Based on Numerical Simulation WORLD ELECTRIC VEHICLE JOURNAL, 2025, 16 (02):
- [30] Numerical Simulation of Fine Blanking Process Using Fully Coupled Advanced Constitutive Equations with Ductile Damage 11TH INTERNATIONAL CONFERENCE ON NUMERICAL METHODS IN INDUSTRIAL FORMING PROCESSES (NUMIFORM 2013), 2013, 1532 : 526 - 531