Surface cracking of a piezoelectric strip bonded to an elastic substrate (Mode I crack problem)

被引:0
|
作者
B. L. Wang
Y. W. Mai
Y. G. Sun
机构
[1] The University of Sydney,Centre for Advanced Materials Technology (CAMT), School of Aerospace, Mechanical and Mechatronic Engineering J07
[2] Harbin Institute of Technology,Center for Composite Materials
来源
关键词
Fracture; Piezoelectricity; Coating; Substrate; Electromechanical coupling;
D O I
暂无
中图分类号
学科分类号
摘要
A piezoelectric material layer bonded to an elastic substrate is investigated. The piezoelectric layer contains an edge crack that is perpendicular to the surface of medium. The poling axis of the piezoelectric layer is parallel to its edge. The elastic layer can be an ideal insulator or an ideal conductor. The Fourier transform technique is used to reduce the problem to a solution of singular integral equations. Both impermeable crack and permeable crack assumptions are considered. Stress and electric displacement intensity factors are investigated for different dimensions of the medium. A double-edge cracked symmetric piezoelectric laminate under symmetric electro-mechanical load is also investigated.
引用
收藏
页码:434 / 447
页数:13
相关论文
共 50 条
  • [41] A mode III crack in a functionally graded piezoelectric material strip
    Wang, BL
    Zhang, XH
    JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, 2004, 71 (03): : 327 - 333
  • [42] Mode III eccentric crack in a functionally graded piezoelectric strip
    Ou, Yi-Liang
    Chue, Ching-Hwei
    INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2006, 43 (20) : 6148 - 6164
  • [43] Mode III fracture problem of an arbitrarily oriented crack in a FGPM strip bonded to a FGPM half plane
    Hsu, Wei-Hung
    Chue, Ching-Hwei
    INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2008, 45 (25-26) : 6333 - 6346
  • [44] The interface crack problem of bonded piezoelectric and elastic half-space under transient electromechanical loads
    Meguid, SA
    Zhao, X
    JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, 2002, 69 (03): : 244 - 253
  • [45] Transient anti-plane crack problem for a functionally graded piezoelectric coating bonded to an elastic layer
    Chen, J
    Wang, W
    Liu, ZX
    ADVANCES IN ENGINEERING PLASTICITY AND ITS APPLICATIONS, PTS 1 AND 2, 2004, 274-276 : 1119 - 1124
  • [46] The interface crack problem of bonded piezoelectric and elastic half-space under transient electromechanical loads
    Meguid, S.A.
    Zhao, X.
    1600, American Society of Mechanical Engineers (69):
  • [47] Multiple surface cracks in a piezoelectric layer bonded to an elastic substrate under transient electromechanical loads
    Wang, Bao-Lin
    Mai, Yiu-Wing
    MECHANICS OF MATERIALS, 2007, 39 (06) : 564 - 579
  • [48] Crack in a bonded functionally graded magneto-electro-elastic strip
    Guo, Li-Fang
    Li, Xing
    Ding, Sheng-Hu
    COMPUTATIONAL MATERIALS SCIENCE, 2009, 46 (02) : 452 - 458
  • [49] Indentation responses of piezoelectric films ideally bonded to an elastic substrate
    Wang, J. H.
    Chen, C. Q.
    INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2011, 48 (19) : 2743 - 2754
  • [50] Transient response of a crack in piezoelectric strip subjected to the mechanical and electrical impacts: mode-III problem
    Wang, XY
    Yu, SW
    INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2000, 37 (40) : 5795 - 5808