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- [3] Temperature Dependence of Electrical and Thermal Conductivities of an Epoxy-Based Isotropic Conductive Adhesive [J]. Journal of Electronic Materials, 2008, 37 : 462 - 468
- [4] Temperature dependence of electrical resistivity of isotropic conductive adhesive composed of an epoxy-based binder [J]. HDP'07: PROCEEDINGS OF THE 2007 INTERNATIONAL SYMPOSIUM ON HIGH DENSITY PACKAGING AND MICROSYSTEM INTEGRATION, 2007, : 149 - +
- [5] Effect of Curing Procedures on the Electrical Properties of Epoxy-Based Isotropic Conductive Adhesives [J]. INTERNATIONAL JOURNAL OF POLYMERIC MATERIALS, 2011, 60 (06): : 409 - 427
- [8] Thermal conductivity of isotropic conductive adhesives composed of an epoxy-based binder [J]. 2006 CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP '06), PROCEEDINGS, 2006, : 63 - +
- [9] Electrical and Thermal Conduction of Isotropic Conductive Adhesive based on Novel Conductive Particles [J]. 2018 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC 2018), 2018, : 40 - 44
- [10] Influence of Curing Procedures on the Flectrical Properties of Epoxy-Based Isotropic Conductive Adhesives [J]. 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 373 - 377