共 50 条
- [1] Effect of Curing Procedures on the Electrical Properties of Epoxy-Based Isotropic Conductive Adhesives [J]. INTERNATIONAL JOURNAL OF POLYMERIC MATERIALS, 2011, 60 (06): : 409 - 427
- [2] Influence of Curing Procedures on the Flectrical Properties of Epoxy-Based Isotropic Conductive Adhesives [J]. 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 373 - 377
- [4] Effect of curing conditions on the interconnect properties of isotropic conductive adhesives composed of an epoxy-based binder [J]. PROCEEDINGS OF THE SEVENTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN, PACKAGING AND FAILURE ANALYSIS (HDP'05), 2005, : 128 - 133
- [5] Influence of silica particles on the electrical and thermal properties of epoxy/silver based isotropic conductive adhesives [J]. ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2012, 243
- [6] Thermal conductivity of isotropic conductive adhesives composed of an epoxy-based binder [J]. 2006 CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP '06), PROCEEDINGS, 2006, : 63 - +
- [8] The Dependence on Thermal History of the Electrical Properties of an Epoxy-Based Isotropic Conductive Adhesive [J]. Journal of Electronic Materials, 2007, 36 : 669 - 675
- [9] A review on epoxy-based electrically conductive adhesives [J]. International Journal of Adhesion and Adhesives, 2020, 99