Violation of the Kaiser Effect under Loading of Eutectic Alloys of the Pb–Sn System

被引:0
|
作者
D. S. Salita
V. V. Polyakov
机构
[1] Altai State University,
[2] Institute of Strength Physics and Materials Science,undefined
[3] Siberian Branch,undefined
[4] Russian Academy of Sciences,undefined
来源
Technical Physics Letters | 2020年 / 46卷
关键词
acoustic emission; Kaiser effect; eutectic alloys.;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:898 / 900
页数:2
相关论文
共 50 条
  • [41] PRESTRAIN EFFECT ON FLOW-STRESS OF SN-PB EUTECTIC ALLOY
    MURTY, GS
    SCRIPTA METALLURGICA, 1972, 6 (11): : 1075 - &
  • [42] THE EFFECT OF GRAIN-SIZE ON DUCTILITY IN THE SUPERPLASTIC PB-SN EUTECTIC
    AHMED, MMI
    LANGDON, TG
    JOURNAL OF MATERIALS SCIENCE LETTERS, 1983, 2 (07) : 337 - 340
  • [43] Effect of microalloying on the creep strength and microstructure of eutectic Sn-Pb solders
    Wade, N.
    Akuzawa, T.
    Kunii, J.
    Miyahara, K.
    Key Engineering Materials, 2000, 171-174 : 663 - 668
  • [44] Effect of extra-gravity on the microstructure and morphology of Pb-Sn eutectic
    Zhao, Zhilong
    Lu, Deyang
    Liu, Lin
    Zhu, Ming
    Cailiao Yanjiu Xuebao/Chinese Journal of Materials Research, 1996, 10 (02): : 153 - 156
  • [45] Eutectic Sn/Pb solder bump and under bump metallurgy: interfacial reactions and adhesion
    Jang, SY
    Paik, KW
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 1998, 10 (03) : 29 - +
  • [46] Effect of lead content on vibration fracture behavior of Pb–Sn eutectic solder
    C. M. Chuang
    T. S. Lui
    L. H. Chen
    Journal of Materials Research, 2001, 16 : 2644 - 2652
  • [47] Eutectic Pb/Sn solder bump and under bump metallurgy interfacial reactions and adhesion
    Jang, SY
    Paik, KW
    2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS, 1998, : 69 - 75
  • [48] Eutectic Pb/Sn solder bump and Under Bump Metallurgy interfacial reactions and adhesion
    Jang, Se-Young
    Paik, Kyung-Wook
    Proceedings of the Electronic Packaging Technology Conference, EPTC, 1998, : 69 - 75
  • [49] Eutectic Sn/Pb solder bump and under bump metallurgy: Interfacial reactions and adhesion
    Jang, Se-Young
    Paik, Kyung-Wook
    Soldering and Surface Mount Technology, 1998, (30): : 29 - 37
  • [50] Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing
    Ye, H
    Basaran, C
    Hopkins, DC
    INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2004, 41 (9-10) : 2743 - 2755