Theoretical estimation of coefficient of thermal expansion for solder alloy

被引:0
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作者
Boon Kwang Lee
Hong Mei Jin
Ping Wu
机构
[1] National University of Singapore,Singapore
[2] Institute of High Performance Computing,MIT Alliance, High Performance Computing for Engineered Systems
来源
关键词
Polymer; Correlation Function; Thermal Expansion; Excellent Agreement; Simple Approach;
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学科分类号
摘要
Coefficient of thermal expansion (CTE) of solder alloy Sn-37%Pb was estimated by using cluster expansion method. Five phases with available experimental CTE in Sn-Pb system were employed to derive the correlation coefficient, qi. Monte-Carlo simulation was carried out to obtain the correlation functions, ξi. With the derived qi and ξi, CTE of Sn-37%Pb was calculated, which is in excellent agreement with experiment. This study may provide a simple approach for the CTE prediction of disordered structures.
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页码:1135 / 1137
页数:2
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