Cu-7Cr-0.1Ag Microcomposites Optimized for High Strength and High Condutivity

被引:0
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作者
Keming Liu
Zhenxi Wang
Zhengyi Jiang
Andrej Atrens
Zhikai Huang
Wei Guo
Xingwang Zhang
Jiuming Yu
Quanguo Lu
Deping Lu
机构
[1] Nanchang Institute of Technology,Jiangxi Key Laboratory of Precision Drive and Control
[2] University of Wollongong,Faculty of Engineering and Information Sciences
[3] The University of Queensland,Division of Materials Engineering
[4] Jiangxi Academy of Sciences,Institute of Applied Physics
关键词
combination of properties; Cu-Cr; microcomposites; thermal stability; trace silver;
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中图分类号
学科分类号
摘要
This paper (i) investigated how the microstructure, conductivity, and mechanical properties of Cu-7Cr-0.1Ag microcomposites were changed by cold drawing and subsequent heat treatment, and (ii) produced the Cu-7Cr-0.1Ag microcomposite with an optimum combination of strength and conductivity. The figure of merit Z (combining strength and conductivity) of the Cu-7Cr-0.1Ag microcomposite was larger than that of the microcomposite without silver for each heat treatment. The value of Z of the Cu-7Cr-0.1Ag microcomposite was a maximum after heat treatment for 1 h at 600 °C, indicating that this was the optimum intermediate heat treatment. The following combinations of conductivity, strength and ductility (measured as elongation to fracture) were obtained by the Cu-7Cr-0.1Ag microcomposite with η = 8: (i) 77.9% IACS (International Annealed Copper Standard), 920 MPa and 3.1%; (ii) 79.3% IACS, 880 MPa and 3.3%; and (iii) 79.9% IACS, 798 MPa and 3.5%. These values for the Cu-7Cr-0.1Ag microcomposite were larger than those of the Cu-7Cr microcomposite.
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页码:933 / 938
页数:5
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