Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films

被引：0
|
作者：
T. L. Su
L. C. Tsao
S. Y. Chang
T. H. Chuang
机构：
[1] National Taiwan University,Department of Materials Science and Engineering
来源：
Journal of Materials Engineering and Performance | 2002年 / 11卷
关键词：
Ag dissolution; Ag; Sn intermetallic compound; Ag thick film; Sn/Ag; Sn-3.5Ag/Ag; soldering reactions;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films are investigated in the temperature range from 250–325 °C, and the morphology of intermetallic compounds formed after such soldering reactions is observed. In kinetics analysis of the growths of intermetallic compounds, it was found that both Sn/Ag and Sn-3.5Ag/Ag reactions were interfacial-controlled, and the growth rates for both cases were similar. The rate of Ag dissolution into liquid solder attendant on the formation of interfacial intermetallic compounds after Sn/Ag reaction was about four times higher than that after Sn-3.5Ag/Ag reaction, as evidenced by experimental results.
引用
收藏
页码：481 / 486
页数：5
相关论文
共 50 条
  • [1] Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films
    Su, TL
    Tsao, LC
    Chang, SY
    Chuang, TH
    JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2002, 11 (05) : 481 - 486
  • [2] Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates
    T. H. Chuang
    H. M. Wu
    M. D. Cheng
    S. Y. Chang
    S. F. Yen
    Journal of Electronic Materials, 2004, 33 : 22 - 27
  • [3] Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and Cu substrates
    Chuang, TH
    Wu, HM
    Cheng, MD
    Chang, SY
    Yen, SF
    JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (01) : 22 - 27
  • [4] Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
    R. W. Wu
    L. C. Tsao
    S. Y. Chang
    C. C. Jain
    R. S. Chen
    Journal of Materials Science: Materials in Electronics, 2011, 22 : 1181 - 1187
  • [5] Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
    Wu, R. W.
    Tsao, L. C.
    Chang, S. Y.
    Jain, C. C.
    Chen, R. S.
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2011, 22 (08) : 1181 - 1187
  • [6] Effects of poss on the interfacial reactions between Sn-3.5Ag solders and Cu substrates during soldering
    Wang, Xue
    Han, Jing
    Guo, Fu
    Ma, Limin
    Wang, Yishu
    2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 1000 - 1005
  • [7] Shear strength of Sn-3.5Ag solder and Sn-3.5Ag/Cu joint
    Luo, Zhongbing
    Wang, Lai
    Gao, Yanjun
    Zhao, Jie
    TRANSFERABILITY AND APPLICABILITY OF CURRENT MECHANICS APPROACHES, 2009, : 511 - 515
  • [8] Creep rupture of lead-free Sn-3.5Ag and Sn-3.5Ag-0.5Cu solders
    Chih-Kuang Lin
    De-You Chu
    Journal of Materials Science: Materials in Electronics, 2005, 16 : 355 - 365
  • [9] Creep rupture of lead-free Sn-3.5Ag and Sn-3.5Ag-0.5Cu solders
    Lin, CK
    Chu, DY
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2005, 16 (06) : 355 - 365
  • [10] Tensile properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu lead-free solders
    Shohji, I
    Yoshida, T
    Takahashi, T
    Hioki, S
    MATERIALS TRANSACTIONS, 2002, 43 (08) : 1854 - 1857
12345