共 50 条
- [41] ATHERMAL LOW-STRESS DISLOCATION MOBILITY IN KCL FIZIKA TVERDOGO TELA, 1989, 31 (04): : 277 - 278
- [42] Development of low-stress and low-noise lightweight railway wheel Nihon Kikai Gakkai Ronbunshu A, 2007, 6 (677-685):
- [45] Low temperature bonding of glass on silicon compounds for biomedical applications Sensors and Microsystems, 2002, : 283 - 287
- [47] Low-Stress Bond Pad Design for Low-Temperature Solder Interconnections on Through-Silicon vias (TSVs) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (04): : 510 - 518