Ultraminiature encapsulated accelerometers as a fully implantable sensor for implantable hearing aids

被引:0
|
作者
Woo-Tae Park
Kevin N. O’Connor
Kuan-Lin Chen
Joseph R. Mallon
Toshiki Maetani
Parmita Dalal
Rob N. Candler
Vipin Ayanoor-Vitikkate
Joseph B. Roberson
Sunil Puria
Thomas W. Kenny
机构
[1] Stanford University,Departments of Mechanical and Electrical Engineering
[2] Stanford University,Department of Otolaryngology—Head and Neck Surgery
[3] California Ear Institute,undefined
来源
Biomedical Microdevices | 2007年 / 9卷
关键词
Accelerometer; Implantable hearing aids; Epi-poly encapsulation; Flex-circuit;
D O I
暂无
中图分类号
学科分类号
摘要
Experiments were conducted to evaluate a silicon accelerometer as an implantable sound sensor for implantable hearing aids. The main motivation of this study is to find an alternative sound sensor that is implantable inside the body, yet does not suffer from the signal attenuation from the body. The merit of the accelerometer sensor as a sound sensor will be that it will utilize the natural mechanical conduction in the middle ear as a source of the vibration. With this kind of implantable sound sensor, a totally implantable hearing aid is feasible. A piezoresistive silicon accelerometer that is completely encapsulated with a thin silicon film and long flexible flex-circuit electrical cables were used for this study. The sensor is attached on the middle ear ossicles and measures the vibration transmitted from the tympanic membrane due to the sound in the ear canal. In this study, the sensor is fully characterized on a human cadaveric temporal bone preparation.
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页码:939 / 949
页数:10
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