In Situ Observation of Small-Scale Deformation in a Lead-Free Solder Alloy

被引：0
|
作者：
Yong Sun
Jin Liang
Zhi-Hui Xu
Guofeng Wang
Xiaodong Li
机构：
[1] University of South Carolina,Department of Mechanical Engineering
[2] EMC Corp.,Department of Mechanical Engineering
[3] Indiana University-Purdue University Indianapolis,undefined
来源：
Journal of Electronic Materials | 2009年 / 38卷
关键词：
SAC alloy; deformation mechanisms; grain boundary sliding; grain boundary decohesion; slip bands;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
In situ observation of the local, small-scale deformation behavior of a Sn-Ag-Cu (SAC387) alloy under extremely small strain rates was realized using a custom-designed mechanical testing stage integrated with atomic force microscopy (AFM) and optical microscopy. Grain boundary sliding (GBS) hand in hand with grain boundary decohesion (GBD) is the dominant mechanism in the early stage of deformation (<8.0% local strain) while intragranular slip bands are observed in the large-strain regime for the dendritic microstructure at room temperature. The deformation mechanisms of SAC387 are discussed in detail with reference to its microstructural constituents and mechanical properties.
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页码：400 / 409
页数：9
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