Chemical bonding evolution on compression of crystals

被引：0
|
作者：
S. S. Batsanov
机构：
[1] Center of High Dynamic Pressure,
来源：
Journal of Structural Chemistry | 2005年 / 46卷
关键词：
electronegativity; pressure; atomization energy; heat of formation; elastic modulus; bond ionicity;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The electronegativity concept has been used to develop a method of determining effective atomic charges in pressurized crystalline binary compounds from the experimental values of volume, compression modulus and thermochemical characteristics. The data obtained are in accord with available spectroscopic data on the chemical bonding.
引用
收藏
页码：306 / 314
页数：8
相关论文
共 50 条
  • [21] Band gap and type of chemical bonding in optical and semiconductor crystals
    Milyukov, EM
    JOURNAL OF OPTICAL TECHNOLOGY, 1996, 63 (12) : 904 - 906
  • [22] Chemical bonding and structure of metastable impurity centers in semiconductor crystals
    D. E. Onopko
    A. I. Ryskin
    Journal of Structural Chemistry, 2000, 41
  • [23] Evolution of interfacial microstructure and oxides of CLAM steel by hot compression bonding
    Bai, Yunfei
    Wang, Jianqiang
    Zhu, Gaofan
    Nagasaka, Takuya
    Shen, Jingjie
    Sun, Mingyue
    Huang, Qunying
    MATERIALS CHARACTERIZATION, 2024, 210
  • [24] Interfacial microstructure evolution and bonding mechanisms of 14YWT alloys produced by hot compression bonding
    Zhou, Liying
    Feng, Shaobo
    Sun, Mingyue
    Xu, Bin
    Li, Dianzhong
    JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2019, 35 (08) : 1671 - 1680
  • [25] Microstructure evolution and bonding mechanism of hot compression bonding joint of reduced activation ferritic/martensitic steel
    Chang, Rui-jiang
    Liu, Guo-wang
    Guo, Qian-ying
    Ding, Ran
    Liu, Chen-xi
    Liu, Yong-chang
    JOURNAL OF IRON AND STEEL RESEARCH INTERNATIONAL, 2025,
  • [26] Interfacial microstructure evolution and bonding mechanisms of 14YWT alloys produced by hot compression bonding
    Liying Zhou
    Shaobo Feng
    Mingyue Sun
    Bin Xu
    Dianzhong Li
    Journal of Materials Science & Technology, 2019, 35 (08) : 1671 - 1680
  • [27] ELECTRONS AND CHEMICAL BONDING - CHEMICAL BONDING
    PARR, RG
    SCIENCE, 1965, 150 (3697) : 738 - &
  • [28] Chemical bonding in isolated molecules and crystals of zwitterionic pentacoordinate silicon chelates
    A. A. Korlyukov
    K. A. Lyssenko
    M. Yu. Antipin
    Russian Chemical Bulletin, 2002, 51 : 1423 - 1432
  • [29] Chemical bonding in isolated molecules and crystals of zwitterionic pentacoordinate silicon chelates
    Korlyukov, AA
    Lyssenko, KA
    Antipin, MY
    RUSSIAN CHEMICAL BULLETIN, 2002, 51 (08) : 1423 - 1432
  • [30] Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface
    Huang, C. H.
    Shih, P. S.
    Huang, J. H.
    Grafner, S. J.
    Chen, Y. A.
    Kao, C. R.
    IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 2163 - 2167
12345