Optimization of the required temperature of contact soldering of electronic devices

被引：0
|
作者：
Shtennikov V.N. [1 ]
Seleznev V.D. [1 ]
机构：
[1] B. N. Yeltsin Ural Federal University, 19 Mir Str.
来源：
Shtennikov, V.N. (Shtennikov_vn@mail.ru) | 1600年 / Springer Science and Business Media, LLC卷 / 86期
关键词：
devices; engineering physics; heat conduction; soldering; temperature; time;
D O I：
10.1007/s10891-013-0928-6
中图分类号：
学科分类号：
摘要：
This paper presents the results of a complex of experimental and theoretical studies aimed at improving the quality of soldering electronic devices by optimizing the design-technological parameters. © 2013 Springer Science+Business Media New York.
引用
收藏
页码：1060 / 1065
页数：5
相关论文
共 50 条
  • [41] In-situ X-ray methods for warpage measurement of electronic devices during a soldering process
    Albrecht, Oliver
    Wohlrabe, Heinz
    Und, Martin Oppermann
    Zerna, Thomas
    [J]. TM-TECHNISCHES MESSEN, 2020, 87 (02) : 130 - 141
  • [42] Design of Numerical Electronic Soldering Station
    Wu, Zaiqun
    Qin, Huanchang
    Pan, Pan
    Yao, Liangyi
    [J]. 2019 2ND INTERNATIONAL CONFERENCE ON MECHANICAL ENGINEERING, INDUSTRIAL MATERIALS AND INDUSTRIAL ELECTRONICS (MEIMIE 2019), 2019, : 118 - 127
  • [43] Calculation of the capacitances of conductors: Perspectives for the optimization of electronic devices
    Kopp, Thilo
    Mannhart, Jochen
    [J]. JOURNAL OF APPLIED PHYSICS, 2009, 106 (06)
  • [44] Global Optimization Methods to Design Vacuum Electronic Devices
    Wang Huihui
    Meng Lin
    Liu Dagang
    Liu Laqun
    [J]. 2016 IEEE INTERNATIONAL VACUUM ELECTRONICS CONFERENCE (IVEC), 2016,
  • [45] Modeling and optimization method of electromagnetic susceptibility for electronic devices
    School of Electronics and Information Engineering, Xi'an Jiaotong University, Xi'an 710049, China
    不详
    [J]. Hsi An Chiao Tung Ta Hsueh, 2008, 6 (688-692):
  • [46] MORE ON SOLDERING AND WELDING ELECTRONIC JOINTS
    KAUFMAN, JW
    [J]. METAL PROGRESS, 1970, 98 (05): : 13 - &
  • [47] SOLDERING WITH LASERS IN ELECTRONIC CIRCUIT PRODUCTION
    不详
    [J]. CONTROL AND INSTRUMENTATION, 1979, 11 (04): : 11 - 11
  • [48] Ultrasonic soldering for structural and electronic applications
    Vianco, PT
    Hosking, FM
    Rejent, JA
    [J]. WELDING JOURNAL, 1996, 75 (11) : S343 - S355
  • [49] Effect of material property, surface temperature and contact duration on the thermal sensation when contacting shell materials of electronic devices
    Tang, Ka-Po Maggie
    Wu, Yuen-Shing
    Fan, Jin-tu
    [J]. APPLIED ERGONOMICS, 2020, 86 (86)
  • [50] HIGH-TEMPERATURE SOLDERING
    LISON, R
    [J]. WERKSTATTSTECHNIK ZEITSCHRIFT FUR INDUSTRIELLE FERTIGUNG, 1981, 71 (01): : 25 - 28
12345