Effect of plated helix on heat dissipation capability of the slow-wave circuit

被引：0
|
作者：
Yong Han
Yanwen Liu
Yaogen Ding
Pukun Liu
Chunhua Lu
机构：
[1] Chinese Academy of Sciences,Institute of Electronics
[2] Graduate University of Chinese Academy of Sciences,undefined
来源：
Heat and Mass Transfer | 2008年 / 45卷
关键词：
Gold Film; Thermal Contact Resistance; Copper Film; Equivalent Thermal Conductivity; Interface Contact Area;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The effect of plated helix on heat dissipation capability of the slow-wave circuit is studied in this paper. With the plated helix, the improvement of the heat dissipation capability of the slow-wave circuit is estimated and evaluated. The influence of helices coated with copper film and gold film is analyzed and verified by computer simulation and experimental tests. The tests show good agreement with the theoretical analysis. The conclusions will make good reference to the design and improvement of the helix TWT.
引用
收藏
页码：93 / 98
页数：5
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