New approaches for growth control of GaN-based HEMT structures

被引:0
|
作者
H. Hardtdegen
R. Steins
N. Kaluza
Y.S. Cho
K. Wirtz
M. von der Ahe
H.L. Bay
G. Heidelberger
M. Marso
机构
[1] Research Center Jülich,Center of Nanoelectronic Systems for Information Technology (CNI), Institute of Bio
来源
Applied Physics A | 2007年 / 87卷
关键词
Sheet Resistance; High Electron Mobility Transistor; Nucleation Layer; Coalescence Time; Transparent Substrate;
D O I
暂无
中图分类号
学科分类号
摘要
This paper reports on new approaches for growth control of GaN-based heterostructures for high frequency and high power application. First in situ methods are presented and their further development discussed [1]. The development leads to a greatly improved observation of growth parameter influences in the MOVPE of GaN. A new growth process is introduced which enhances growth reproducibility [2]. This new growth process is then optimized with respect to the envisaged application. To this end process modeling will be employed. The application envisaged is the AlxGa1-xN/GaN high electron mobility transistor (HEMT). At last device results will be presented. All in all it will be shown how fundamental research can drive technology and how basic knowledge can be employed for process development with respect to device applications.
引用
收藏
页码:491 / 498
页数:7
相关论文
共 50 条
  • [1] New approaches for growth control of GaN-based HEMT structures
    Hardtdegen, H.
    Steins, R.
    Kaluza, N.
    Cho, Y. S.
    Wirtz, K.
    von der Ahe, M.
    Bay, H. L.
    Heidelberger, G.
    Marso, M.
    [J]. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2007, 87 (03): : 491 - 498
  • [2] Finite-Element Thermal Modeling of GaN-based HEMT Structures
    Costi, F.
    Bertoluzza, F.
    Delmonte, N.
    Sozzi, G.
    Menozzi, R.
    [J]. 2008 ROCS WORKSHOP, PROCEEDINGS, 2008, : 15 - 24
  • [3] Piezoelectric response of AlGaN/GaN-based circular-HEMT structures
    Lalinsky, T.
    Drzik, M.
    Vanko, G.
    Vallo, M.
    Kutis, V.
    Bruncko, J.
    Hascik, S.
    Jakovenko, J.
    Husak, M.
    [J]. MICROELECTRONIC ENGINEERING, 2011, 88 (08) : 2424 - 2426
  • [4] Reliability of GaN-Based HEMT Devices
    Menozzi, Roberto
    [J]. COMMAD: 2008 CONFERENCE ON OPTOELECTRONIC AND MICROELECTRONIC MATERIALS & DEVICES, 2008, : 44 - 50
  • [5] Recent improvements of flexible GaN-based HEMT technology
    Mhedhbi, Sarra
    Lesecq, Marie
    Altuntas, Philippe
    Defrance, Nicolas
    Cordier, Yvon
    Damilano, Benjamin
    Jimenez, Gema Tabares
    Ebongue, Abel
    Hoel, Virginie
    [J]. PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2017, 214 (04):
  • [6] Recent Advances in GaN-Based Power HEMT Devices
    He, Jiaqi
    Cheng, Wei-Chih
    Wang, Qing
    Cheng, Kai
    Yu, Hongyu
    Chai, Yang
    [J]. ADVANCED ELECTRONIC MATERIALS, 2021, 7 (04)
  • [7] Testing the Temperature Limits of GaN-Based HEMT Devices
    Maier, David
    Alomari, Mohammed
    Grandjean, Nicolas
    Carlin, Jean-Francois
    di Forte-Poisson, Marie-Antoinette
    Dua, Christian
    Chuvilin, Andrey
    Troadec, David
    Gaquiere, Christophe
    Kaiser, Ute
    Delage, Sylvain L.
    Kohn, Erhard
    [J]. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2010, 10 (04) : 427 - 436
  • [8] A Novel GaN-based Monolithic SAW/HEMT Oscillator on Silicon
    Lu, Xing
    Ma, Jun
    Zhu, Xue Liang
    Lee, Chi Ming
    Yue, C. Patrick
    Lau, Kei May
    [J]. 2012 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS), 2012, : 2206 - 2209
  • [9] Analytical Model for Power Switching GaN-Based HEMT Design
    Esposto, Michele
    Chini, Alessandro
    Rajan, Siddharth
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2011, 58 (05) : 1456 - 1461
  • [10] Breakdown investigation in GaN-based MIS-HEMT devices
    Marino, Fabio Alessio
    Bisi, Davide
    Meneghini, Matteo
    Verzellesi, Giovanni
    Zanoni, Enrico
    Van Hove, Marleen
    You, Shuzhen
    Decoutere, Stefaan
    Marcon, Denis
    Stoffels, Steve
    Ronchi, Nicolo
    Meneghesso, Gaudenzio
    [J]. PROCEEDINGS OF THE 2014 44TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE (ESSDERC 2014), 2014, : 377 - 380