Highest wave types in transmission lines for three-dimensional microwave and extremely high frequency integrated circuits

被引：0
|
作者：
S. B. Klyuev
E. V. Mezhekova
E. I. Nefedov
R. S. Popov
机构：
[1] Russian Academy of Sciences,Institute of Radio Engineering and Electronics
来源：
Doklady Physics | 2002年 / 47卷
关键词：
Microwave; Transmission Line; High Wave; Wave Type;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：297 / 301
页数：4
相关论文
共 50 条
  • [41] Integration schemes and enabling technologies for three-dimensional integrated circuits
    Chen, K. N.
    Tan, C. S.
    IET COMPUTERS AND DIGITAL TECHNIQUES, 2011, 5 (03): : 160 - 168
  • [42] Architectural Benefits and Design Challenges for Three-dimensional Integrated Circuits
    Xie, Jing
    Zhao, Jishen
    Dong, Xiangyu
    Xie, Yuan
    PROCEEDINGS OF THE 2010 IEEE ASIA PACIFIC CONFERENCE ON CIRCUIT AND SYSTEM (APCCAS), 2010, : 540 - 543
  • [43] Routing Complexity Minimization of Monolithic Three-Dimensional Integrated Circuits
    Lin, Sheng-En
    Kim, Dae Hyun
    PROCEEDINGS OF THE 2019 20TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED), 2019, : 329 - 334
  • [44] Fast, automated thermal simulation of three-dimensional integrated circuits
    Wilkerson, P
    Raman, A
    Turowski, M
    ITHERM 2004, VOL 1, 2004, : 706 - 713
  • [45] Thermal Considerations for Monolithic Integration of Three-Dimensional Integrated Circuits
    Henning, A. K.
    Rajendran, B.
    Cronquist, B.
    Or-Bach, Z.
    2013 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S), 2013,
  • [46] Special Issue on Testing of Three-Dimensional Stacked Integrated Circuits
    Agrawal, Vishwani D.
    JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2012, 28 (01): : 1 - 1
  • [47] InP-based three-dimensional photonic integrated circuits
    Tsou, D
    Zaytsev, S
    Pauchard, A
    Hummel, S
    Lo, YH
    ADVANCES IN MICROELECTRONIC DEVICE TECHNOLOGY, 2001, 4600 : 10 - 13
  • [48] Addressing Aging Issues in Heterogeneous Three-Dimensional Integrated Circuits
    Ma, Yu
    Jia, Dingcheng
    Gao, Wei
    Zhou, Pingqiang
    2019 IEEE 13TH INTERNATIONAL CONFERENCE ON ASIC (ASICON), 2019,
  • [49] Thermal Via Structural Design in Three-Dimensional Integrated Circuits
    Hwang, Leslie
    Lin, Kevin L.
    Wong, Martin D. F.
    2012 13TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED), 2012, : 103 - 108
  • [50] Charged Device Model Reliability of Three-Dimensional Integrated Circuits
    Shukla, Vrashank
    Rosenbaum, Elyse
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2015, 15 (04) : 559 - 566
12345