High-speed confined granular flows down smooth inclines: scaling and wall friction laws

被引:0
|
作者
Yajuan Zhu
Renaud Delannay
Alexandre Valance
机构
[1] Univ Rennes,Institut de Physique de Rennes, CNRS UMR 6251
来源
Granular Matter | 2020年 / 22卷
关键词
High-speed granular flows; Longitudinal vortices; Supported flows; Effective friction;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 47 条
  • [41] Probing vortex-shedding at high frequencies in flows past confined microfluidic cylinders using high-speed microscale particle image velocimetry
    Zhang, Shigang
    Cagney, Neil
    Balabani, Stavroula
    Naveira-Cotta, Carolina P.
    Tiwari, Manish K.
    PHYSICS OF FLUIDS, 2019, 31 (10)
  • [42] A low-jitter RF PLL frequency synthesizer with high-speed mixed-signal down-scaling circuits
    唐路
    王志功
    薛红
    何小虎
    徐勇
    孙玲
    半导体学报, 2010, 31 (05) : 106 - 113
  • [43] A low-jitter RF PLL frequency synthesizer with high-speed mixed-signal down-scaling circuits
    Tang Lu
    Wang Zhigong
    Xue Hong
    He Xiaohu
    Xu Yong
    Sun Ling
    JOURNAL OF SEMICONDUCTORS, 2010, 31 (05) : 0550081 - 0550088
  • [44] ON THE V2-BASED TURBULENCE MODEL FOR FREE-STREAM AND WALL-BOUNDED HIGH-SPEED COMPRESSIBLE FLOWS
    Molchanov, Alexander M.
    Yanyshev, Dmitry S.
    Bykov, Leonid, V
    Platonov, Ivan M.
    INTERNATIONAL JOURNAL OF FLUID MECHANICS RESEARCH, 2019, 46 (06) : 565 - 578
  • [45] Microstructure and mechanical properties of aluminium alloy thin-wall parts in wire arc additive manufacturing hybrid interlayer high-speed friction
    Chen C.
    Sun G.
    Feng T.
    Fan C.
    Zhang H.
    Hanjie Xuebao/Transactions of the China Welding Institution, 2022, 43 (09): : 38 - 43
  • [46] Microstructure and mechanical characteristics of 307Si stainless steel thin-wall parts in wire arc additive manufacturing hybrid interlayer high-speed friction
    Chen, Chao
    Feng, Tianting
    Sun, Guorui
    Zhang, Huijing
    MANUFACTURING LETTERS, 2022, 33 : 42 - 45
  • [47] Sub-30nm scaling and high-speed operation of fully-confined Access-Devices for 3D crosspoint memory based on Mixed-Ionic-Electronic-Conduction (MIEC) Materials
    Virwani, K.
    Burr, G. W.
    Shenoy, R. S.
    Rettner, C. T.
    Padilla, A.
    Topuria, T.
    Rice, P. M.
    Ho, G.
    King, R. S.
    Nguyen, K.
    Bowers, A. N.
    Jurich, M.
    BrightSky, M.
    Joseph, E. A.
    Kellock, A. J.
    Arellano, N.
    Kurdi, B. N.
    Gopalakrishnan, K.
    2012 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2012,