共 50 条
- [43] The Effects of Microstructure and Ag3Sn and Cu6Sn5 Intermetallics on the Electrochemical Behavior of Sn-Ag and Sn-Cu Solder Alloys INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE, 2012, 7 (07): : 6436 - 6452
- [44] Effect of Melting Temperature on Wettability of Sn-Ag-Cu Alloys on Cu Substrate JOURNAL OF POLYTECHNIC-POLITEKNIK DERGISI, 2018, 21 (03): : 587 - 589
- [45] ON THERMODYNAMICS OF OXYGEN IN MOLTEN COPPER, CU-SN, AND CU-AG ALLOYS METALLURGICAL TRANSACTIONS, 1970, 1 (05): : 1235 - &
- [47] Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys Journal of Electronic Materials, 2000, 29 : 1122 - 1136
- [48] Wetting of Cu by Bi–Ag based alloys with Sn and Zn additions Journal of Materials Science, 2010, 45 : 4339 - 4344
- [49] Formation of Primary Intermetallic Compounds in Sn-Ag-Cu Alloys PRICM 7, PTS 1-3, 2010, 654-656 : 1397 - 1399