Oxidized bridges technology for suspended MEMS fabrication using standard silicon wafer

被引：0
|
作者：
A. Postnikov
O. V. Morozov
I. I. Amirov
机构：
[1] Russian Academy of Sciences,Physics
来源：
Microsystem Technologies | 2015年 / 21卷
关键词：
Trench; Electrical Isolation; Comb Drive; Substrate Bias Voltage; Bulk Micromachining;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
This paper presents a new method for electrically isolating released single crystal silicon MEMS structures. The technology employees double-side processing deep reactive ion etching to obtain functional high aspect ratio micromechanical structures and deep silicon oxidizing to isolate them from bulk silicon. Applicability of the technology to MEMS design was demonstrated with fabrication of the monolithic integrated bulk micromachined comb drive.
引用
收藏
页码：669 / 674
页数：5
相关论文
共 50 条
  • [31] Hermetic Wafer Level Packaging of MEMS Components Using Through Silicon Via and Wafer to Wafer Bonding Technologies
    Zoschke, K.
    Manier, C. -A.
    Wilke, M.
    Juergensen, N.
    Oppermann, H.
    Ruffieux, D.
    Dekker, J.
    Heikkinen, Hannele
    Dalla Piazza, S.
    Allegato, G.
    Lang, K. -D.
    2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 1500 - 1507
  • [32] Study of silicon-based MEMS technology and its standard process
    Inst. of Microelectron., Peking Univ., Beijing 100871, China
    Tien Tzu Hsueh Pao/Acta Electronica Sinica, 2002, 30 (11): : 1577 - 1584
  • [33] Stress reduction and wafer bow accommodation for the fabrication of thin film lithium niobate on oxidized silicon
    Prabhakar, Karan
    Patton, Ryan J.
    Reano, Ronald M.
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2021, 39 (06):
  • [34] Fabrication of miniature silicon wafer fuel cells using micro fabrication technologies
    Yu, JG
    Cheng, P
    Ma, ZQ
    Yi, BL
    FUEL CELL SCIENCE, ENGINEERING AND TECHNOLOGY, 2003, : 287 - 291
  • [35] Stress reduction and wafer bow accommodation for the fabrication of thin film lithium niobate on oxidized silicon
    Prabhakar, Karan
    Patton, Ryan J.
    Reano, Ronald M.
    Journal of Vacuum Science and Technology B, 2021, 39 (06):
  • [36] A novel cavity-first process for flexible fabrication of MEMS on silicon on insulator (SOI) wafer
    Lu, Jian
    Zhang, Lan
    Takagi, Hideki
    Maeda, Ryutaro
    MICROELECTRONIC ENGINEERING, 2014, 119 : 28 - 31
  • [37] A high-temperature MEMS heater using suspended silicon structures
    Lee, Kook-Nyung
    Lee, Dae-Sung
    Jung, Suk-Won
    Jang, Yun-Ho
    Kim, Yong-Kweon
    Seong, Woo-Kyeong
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2009, 19 (11)
  • [38] Fabrication of micro DMFC stack using MEMS Technology
    Suo, Chunguang
    Zhang, Wenbin
    Su, Shi
    MATERIAL DESIGN, PROCESSING AND APPLICATIONS, PARTS 1-4, 2013, 690-693 : 985 - +
  • [39] Fabrication of micro components to Silicon wafer using EDM process
    Weng, FT
    Hsu, CS
    Lin, WF
    PROGRESS ON ADVANCED MANUFACTURE FOR MICRO/NANO TECHNOLOGY 2005, PT 1 AND 2, 2006, 505-507 : 217 - 222
  • [40] Fabrication of oxidized porous silicon (OPS) air-bridge for RF application using micromachining technology
    Kim, YM
    Noh, KY
    Park, JY
    Lee, JH
    Kim, YD
    Yu, IS
    Cho, CS
    JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 2001, 39 : S268 - S270
12345