Effect of strong magnetic field on solid solubility and microsegregation during directional solidification of Al-Cu alloy

被引:0
|
作者
Xi Li
Annie Gagnoud
Zhongming Ren
Yves Fautrelle
François Debray
机构
[1] Shanghai University,Department of Materials Science Engineering
[2] EPM/SIMAP,undefined
[3] Grenoble Institute of Technology,undefined
[4] Grenoble High Magnetic Field Laboratory,undefined
来源
关键词
D O I
暂无
中图分类号
学科分类号
摘要
The effect of a strong magnetic field on the solid solubility and the microsegregation during directional solidification of Al-Cu alloy at lower growth speeds (1-10 μm/s) has been investigated experimentally. Results indicate that the magnetic field causes the reduction of the grain boundary and promotes the amalgamation of the grains. Further, measurement results reveal that the magnetic field increases the solid solubility and decreases the microsegregation. It is also found that the value of the solid solubility increases as the magnetic field and the temperature gradient increase. The modification of the solid solubility and the microsegregation under the magnetic field is attributed to the thermoelectric magnetic force acting on the solid and the interdendritic thermoelectric magnetic convection. The present work may initiate a new method to enhance the solid solubility and to eliminate the microsegregation in Al-based alloys via an applied strong magnetic field during directional solidification.
引用
收藏
页码:2810 / 2818
页数:8
相关论文
共 50 条
  • [21] EFFECT OF STIRRING ON THE SOLIDIFICATION STRUCTURE OF AN AL-CU ALLOY
    THANH, LN
    DURAND, F
    MEMOIRES ET ETUDES SCIENTIFIQUES DE LA REVUE DE METALLURGIE, 1990, 87 (12): : 749 - 759
  • [22] Effect of transverse magnetic field on the liquid-solid interface stability and morphology of Al-0.85wt% Cu alloy during directional solidification
    Yuan, G. Z.
    Ren, W. L.
    Ren, Z. M.
    Zhong, Y. B.
    Li, C. J.
    Fan, Y. F.
    Yu, J. B.
    3RD INTERNATIONAL CONFERENCE ON ADVANCES IN SOLIDIFICATION PROCESSES, 2012, 27
  • [23] EFFECT OF APPLIED PRESSURE DURING SOLIDIFICATION ON THE MICROSTRUCTURAL REFINEMENT IN AN AL-CU ALLOY
    HAN, YS
    KIM, DH
    LEE, HI
    KIM, YG
    SCRIPTA METALLURGICA ET MATERIALIA, 1994, 31 (12): : 1623 - 1628
  • [24] Reduction in Microsegregation in Al–Cu Alloy by Alternating Magnetic Field
    Sheng-Ya He
    Chuan-Jun Li
    Tong-Jun Zhan
    Wei-Dong Xuan
    Jiang Wang
    Zhong-Ming Ren
    Acta Metallurgica Sinica (English Letters), 2020, 33 : 267 - 274
  • [25] Investigation on the formation mechanism of irregular dendrite during directional solidification of Al-Cu alloys under a high magnetic field
    Li, Xi
    Li, Qiuyan
    Ren, Zhongming
    Fautrelle, Yves
    Lu, Xionggang
    Gagnoud, Annie
    Zhang, Yudong
    Esling, Claude
    Wang, Hui
    Dai, Yinming
    Wang, Qiuliang
    JOURNAL OF ALLOYS AND COMPOUNDS, 2013, 581 : 769 - 775
  • [26] Investigation on the formation mechanism of irregular dendrite during directional solidification of Al-Cu alloys under a high magnetic field
    Department of Material Science and Engineering, Shanghai University, Shanghai 200072, China
    不详
    不详
    不详
    Li, X. (lx_net@sina.com), 1600, Elsevier Ltd (581):
  • [27] Numerical and experimental investigation of solidification structure in horizontal directional solidification process of Al-Cu alloy
    Zhai, Q.-J. (qjzhai@shu.edu.cn), 1600, Central South University of Technology (23):
  • [28] Effect of a magnetic field on dendritic morphology in Al-Cu hypoeutectic alloy
    Li, Chuanjun
    Ren, Zhongming
    Ren, Weili
    3RD INTERNATIONAL CONFERENCE ON ADVANCES IN SOLIDIFICATION PROCESSES, 2012, 27
  • [29] Effect of steady magnetic field on undercooling of Al-Cu alloy melts
    Guo, Rui
    Li, Chuanjun
    He, Shengya
    Wang, Jiang
    Xuan, Weidong
    Li, Xi
    Zhong, Yunbo
    Ren, Zhongming
    EPL, 2019, 126 (04)
  • [30] Unidirectional solidification of Al-Cu alloy films between solid plates
    Mori, N
    Kitaoka, T
    Miyahara, H
    Ogi, K
    JOURNAL OF THE JAPAN INSTITUTE OF METALS, 1996, 60 (09) : 863 - 869